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AI chips: US export controls affecting China

Track successive controls on computing chips, manufacturing equipment and high-bandwidth memory. These policy changes are one branch of international AI competition.

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US Bureau of Industry and SecurityPrimary record

BIS releases three updating rules - source record

www.bis.gov

Supports this dated milestone; source wording is summarized independently.

Published: Publication date not provided
Source checked: 9/21/2026
Reviewed 9/21/2026

Selected October 2022-December 2024 measures; this is not a current export-compliance guide.

Dates without a time use the local date of the event.

Recorded event

BIS introduces advanced-computing controls

BIS announced controls affecting advanced computing chips, semiconductor manufacturing and supercomputer uses involving China.

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Different parts began on October 7, 12 and 21. The announcement date should not be read as one effective date for every provision.

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Recorded event

BIS releases three updating rules

BIS released three rules updating the 2022 controls, covering advanced computing, semiconductor manufacturing equipment and Entity List additions.

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The release date precedes Federal Register publication. Separate rules can have different effective dates and transition provisions.

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US Bureau of Industry and SecurityPrimary record

BIS releases three updating rules - source record

www.bis.gov

Supports this dated milestone; source wording is summarized independently.

Published: Publication date not provided
Source checked: 9/21/2026
Recorded event

Controls extend to high-bandwidth memory

BIS announced a package adding controls on high-bandwidth memory and further semiconductor manufacturing equipment, alongside Entity List changes.

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The memory controls show that access to AI computing depends on more than the processor alone.

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Through 12/2/2024

Selected October 2022-December 2024 measures; this is not a current export-compliance guide.

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